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STRUCTURE PRODUCT NAME MODEL NAME FEATURES

Silicon Monolithic Integrated Circuit Synchronous rectification with built-in FET type DC/DC converter IC
BD8649EFV
Synchronous rectification with built-in FET type DC/DC converter Output current 3A Reference voltage accuracy FB 0.8V1% Switching frequency 100kHz600kHz Over current protection circuit Thermal shutdown Input low voltage detection UVLO Soft start / Start delay circuit Programmable OFFLATCH time ABSOLUTE MAXIMUM RATING
Parameter Input supply voltage BOOT terminal voltage EN terminal voltage Input terminal voltage SW terminal voltage Output switch current Power dissipation Operating temperature Storage temperature
Ta=25
Limits 20 28 GND-0.3 VIN+0.3 GND-0.3 7 GND-0.3 VIN+0.3 3.5*2 3.2*3 -20 85 -55 150
150
Symbol VIN VBOOT VEN VINP*1 VSW IOUT Pd Topr Tstg
Unit V V V V V A
Maximum Junction Tjmax Temperature 1 VINP Application terminal SS/DELAY, FB, FC, RT, PSET
2 Do not however exceed Pd. 3 70mmx70mm, thickness 1.6mm, and four layer glass epoxy substratesWhen mounting substrate and the package back exposure part are connected with solder. Operating at higher than Ta=25, 9.5mW shall be reduced per 1
Operation condition
Parameter Input supply voltage Output switch current Symbol VIN IOUT MIN 4.5 TYP MAX 18.0 3.0 Unit A
This product is not designed for protection against radioactive rays.
REV. A
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Electrical characteristic
(Unless otherwise noted Ta=25, VIN=12V, VEN = 3V) Parameter VIN supply current (operating) VIN supply current (standby) Reference voltage Oscillation frequency High side FET ON resistance Low side FET ON resistance UVLO voltage SW leak current EN terminal H threshold voltage EN terminal L threshold voltage SS/DELAY terminal source current SS/DELAY - FB Offset voltage PSET terminal source current PSET terminal threshold voltage Current capability should not exceed Pd. Symbol IQ active IQ VFB OSC RHFET RLFET VUVLO ILSW VENH VENL ISSSO VSSFBOST IPSET VPSET MIN 0.792 270 3.8 1.6 2.8 450 3 0.8 Specification value TYP 1.5 0.8 0.8 300 110 110 4.0 0 4 600 5 1.0 MAX 2.5 1.2 0.808 330 160 160 4.2 5 0.4 5.2 750 7 1.2 UNIT mA mA V kHz m m V A V V A mV A V Condition VFB = 0.75V VEN = 0V FB-FC Short RRT= 56k ISW = -1A ISW = 1A VIN Sweep VEN= 0V
VSS= 1V VSS= 1V VPSET= 2V
VFB :FB terminal voltageVEN :EN terminal voltageVSS :SS/DELAY terminal voltage, VPSET :PSET terminal voltage, RRT :RT resistor
REV. A
3/4
BLOCK DIAGRAM
FB 1 FC 2 RT 3 PSET 4 EN 5 NC 6 NC 7 VIN 8 VIN 9 VIN 10 11 12 PGND 13 PGND 14 PGND EN PWM CONTROL 16 SW 15 SW VOUT Protect time OSC
5V
GND 20 SS/DELAY Softstart/Delay 19 NC 18 CURRENT DET BOOT 17 SW
PIN ASSIGNMENT
No. 1 2 3 4 5 6 7 8 9 10 Symbol FB FC RT PSET EN NC NC VIN VIN VIN Description Feedback terminal Phase amends terminal Frequency adjustment resistance connection terminal Adjust OFF LATCH time terminal Enable input Power supply input terminal Power supply input terminal Power supply input terminal No. 11 12 13 14 15 16 17 18 19 20 Symbol PGND PGND PGND SW SW SW BOOT NC SS/DELAY GND Description Power GND terminal Power GND terminal Power GND terminal Switching output terminal Switching output terminal Switching output terminal Boot strap terminal Soft start adjustment capacity connection terminal Signal GND terminal
PACKAGE OUTLINE
Product number
BD8649
1PIN MARK Lo No.
HTSSOP-B20 (UNITmm)
REV. A
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NOTE ON USE
1About the absolute maximum rating Attention is brushed off enough to the quality control, it is likely to destroy when the absolute maximum rating such as impressed voltages (VCC_IN,DCIN) and ranges (Topr) of the operating temperature as it is exceeded, the mode of breakings of the short or the opening, etc. cannot be specified, and examine it in this IC to give physical measures for safety such as fuses when a special mode that exceeds the absolute maximum rating is assumed. 2GND pin voltage GND terminal should be connected the lowest voltage, under all conditions. And all terminals except SW should be under GND terminal voltage under all conditions including transient situations. If a terminal exists under GND,it should be inserting a bypass route. 3Power dissipation If IC is used on condition that the power loss is over the power dissipation, the reliability will become worse by heat up, such as reduced output current capability. Also, be sure to use this IC within a power dissipation range allowing enough of margin. 4Input supply voltage Input supply pattern layout should be as short as possible. 5About the short and the miss-installation between terminals Note the direction and the miss-registration of IC enough when you install it in the set substrate. IC might destroy it as well as reversely connecting the power supply connector when installing it by mistake. Moreover, there is fear of destruction when the foreign body enters between terminals, the terminal, the power supply, and grandeur and it is short-circuited. 6About operation in strong electromagnetic field In use in strong electromagnetic field, note that there is a possibility of malfunctioning. 7About the inspection by the set substrate It is likely to suffer stress to IC and discharge electricity every one process when you connect the capacitor with the pin with low impedance when inspecting it in the set substrate. Moreover, detach it after connecting after the power supply is turned off without fail when detaching it to G in the inspection process, inspecting, and turning off the power supply. n addition, be give the earth to the assembly process as a static electricity measures, and careful enough when it transports and you preserve it. 8About each input terminal This IC is a monolithic IC which has a P+ isolations and P substrate to isolate elements each other. This P layer and an N layer in each element form a PN junction to construct various parasitic elements. For instance, the potential difference operates in resistance as shown in the figure below when resistance and the transistor connect it with the terminal and the playground (GND) >(terminal B) joint of PN operates as a parasitic diode in playground (GND) >(terminal A) transistor (NPN). In addition, the NPN transistor of parasitism works with N layer of the element of the above-mentioned parasitic diode and the neighborhood and others in transistor (NPN). A parasitic element in IC composition is inevitably formed because of the potential relation. A parasitic element can operate, the interference with the circuit operation be caused, it malfunction, and, consequently, it cause destruction. Therefore, do not do the usage that a parasitic element operates as a voltage that is lower than the playground (GND;P substrate) is impressed to the input terminal enough. Moreover, do not impress the voltage to the input terminal when you do not impress the power-supply voltage to IC. Give each input terminal to me the voltage below the power-supply voltage or in the guarantee value of an electric characteristic when you similarly impress the power-supply voltage.
Example of IC of simple structure
9Earth wiring pattern If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring impedance and large current not to change voltage of small signal GND, each ground terminal of IC must be connected at the one point on the set circuit board. As for GND of external parts, it is similar to the above-mentioned. 10. SW terminal A counter-electromotive force may generate a negative potential at the SW terminal during connection to the particular application. Therefore, it should be inserting a bypass route between SW to GND. 11. About each output terminal We recommend to put Diode for protection purpose in case of output pin connected with large load of impedance or reserve current occurred at initial and output off. 12. Thermal Shut Down Circuit A temperature control is built in the IC to prevent the damage due to overheat. Therefore, the outputs are turned off when the thermal circuit works. 13. Over Output Current Protection SW Output terminal has over current protection circuit of 5A, with prevents IC from being damage by short circuit at over current. However, It is recommend not to use that continuously operates the protection circuit (For instance, always the load that greatly exceeds the output current ability is connected or the output is short-circuited, etc.) in these protection circuits by an effective one to the destruction prevention due to broken accident.
REV. A
Appendix
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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Appendix-Rev4.0


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